Assembly and packaging

Dicing

The Disco DAD3241 dicing saw is a high-productivity automatic dicing saw for dicing silicon glass or bonded substrates.

Laser cutting 

The high-powered ometch AF2440-100  CO2 laser cutter offers potent laser beams with heavy duty cutting ability

Tool specs:
• Max. Engraving Speed: 600 mm/s
• Max. Cutting Depth: 10 mm
• Focus Adjustment: Auto Focus
• Laser type: CO2
• Laser power: 100W
• Processing Area (L×W): 500 mm x 300 mm 
• Front/Back Pass-Through Size: 1000 mm x 600 mm 

Grinding-Polishing

AutoMet 250 is an advanced grinder-polisher with more power to accommodate a greater capacity for high-volume environments. The straightforward controls remove complexity from the grinding and polishing process.

Tool specs:

•Platen Diameter: 8in [203mm], 10in [254mm]
• Platen Wheel Speed: 10-500rpm in 10rpm increments
• Wheel Direction: Clockwise or Counter-Clockwise
• Water Supply Hose: 0.25in [6mm] OD tube
• Water Supply Pressure: 40-100psi [25-60bar]
• Central Specimen Force: 5-60 lbs [20-260N]
• Single Specimen Force: 1-10 lbs [5-45N]

Thermal processing

Thermo Scientific Heratherm™ Convection Oven

Tool specs:

Type: Mechanical Convection Oven
Capacity: 62L
Temperature: 50°C to 330°C
Temperature Stability: ±0.2°C

Thermo Scientific Lindberg/Blue M™ Vacuum Oven

Tool specs:

Capacity: 0.65 cu.ft.
Temperature: 6°C to 260°C
Temperature Resolution: ±1°C
Temperature Uniformity: ±3.5°C
Vacuum Range 1 x 10-2 torr
No. of Shelves: 3
Chamber Material: Corrosion-resistant Stainless Steel