Wet Chemical processing

Lithography processing

The Reynolds Tech lithography bench contains spin coater and hot plates for lithography photoresists spin-coating, soft-baking, post-baking and related applications.

Spin coater specs:

Up to 150 mm round or 4” square substrates
Max. number of recipes: 200
Max. Number of process steps: 40
Programmable step time: 1-999 s
Max. spin speed: 80,000 +/- 1 rpm
Max. acceleration: 4,000 rpm/s

EMS Hot plate specs:

Temperature range: 50–250°C
Temperature accuracy: ±1%

Torrey Pines HS-40 stirring hot plate:

Temperature range: 0–450°C
Readability：1°C
Temperature accuracy: ± 1%
Temperature stability：1°C
Stirring speed: 100-1500 rpm

Developer wet bench

The ReynoldsTech Developer Wet Bench is a specialized wet processing station designed for precise and controlled development of photoresist patterns in microfabrication workflows for MEMS, microfluidics and biodevice fabrication. Engineered for cleanroom environments, it is designed to handle a variety of developers used in cleanroom lithography processes. These include both aqueous alkaline developers and solvent-based developers, depending on the type of photoresists and applications. It is equipped with appropriate ventilation and safety mechanisms to handle hazardous chemicals safely.

Solvent wet bench

The ReynoldsTech Solvent Wet Bench is a specialized wet processing station designed for solvent-based applications in cleanroom environments. Engineered to handle various solvents and cleaning agents safely, it supports processes such as photoresist development, metal lift-off, and substrate cleaning.

HF wet bench

The ReynoldsTech HF Wet Bench is a specialized wet processing station designed for the safe handling and application of hydrofluoric acid (HF) in cleanroom environments. It is integral to processes such as oxide etching, surface preparation, and wafer cleaning for semiconductor and microfabrication applications.

Electroplating wet bench

The Reynolds Tech Electroplating Wet Bench is a specialized wet processing station designed for electrochemical and electroless metal deposition processes in cleanroom environments. Engineered to handle various plating chemistries safely, it supports processes such as copper, nickel, gold, and other metal depositions, making it suitable for applications in MEMS, microfabrication, microfluidics, and biodevice fabrication.