The Conconi Family Biodevice Foundry

The tabletop µMLA system is a cutting-edge laser writing system for chrome-on-glass photomask fabrication. It is suitable for a wide range of microscale applications including but are not limited to microfluidics, MEMS, micro-optics, microlens arrays, sensors, etc.

Tool specs:
Minimum feature size: 1 µm
Minimum lines and space: 1.5 µm
Maximum Exposure Area: 150 x 150 mm2
Laser wavelength: 365 nm

The Model 200IR Mask Aligner is for mask alignment and UV exposure application for Microfluidics, MEMS, etc. It provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts, and it is capable of one micron resolution and alignment precision.

Tool specs:
Substrate stage: X, Y Travel ±10mm
Z Travel 1,500 microns
Rotation ±3.5˚

Tool specs:
Up to 150 mm round or 4” square substrates
Max. number of recipes: 200
Max. Number of process steps: 40
Programmable step time: 1-999 s
Max. spin speed: 80,000 +/- 1 rpm
Max. acceleration: 4,000 rpm/s

Tool specs:
Up to 150 mm round or 4” square substrates
Max. number of recipes: 200
Max. Number of process steps: 40
Programmable step time: 1-999 s
Max. spin speed: 80,000 +/- 1 rpm
Max. acceleration: 4,000 rpm/s

EMS Hotplate
Tool specs:
Temperature range: 50–250°C
Temperature accuracy: ±1%

Torey Pines HS-40 stirring hot plate
Tool specs:
Temperature range: 0–450°C
Readability：1°C
Temperature accuracy: ± 1%
Temperature stability：1°C
Stirring speed: 100-1500 rpm

The Bruker DXT-E stylus profilometer provides the fundamental capabilities needed to collect accurate step height and surface roughness measurements.

Tool specs:
Manual X/Y stage with 4″ x 4″”(100x100mm) of travel, no rotation available.
4 inch sample platform.
Scan length: 50 μm minimum to 55 mm maximum
Vertical range: 524 μm
Vertical resolution: 0.1 nm at 6.5 μm range, 1 nm at 65.5 μm range and 8 nm at 524 μm range
A step-height repeatability of 4 Å.

Microqubic MRCL700 3D microscope

Olympus MX63 microscope

The HR 30 is a premier research-grade rheometer for scientists looking to advance the boundaries of material science by exploiting its unparalleled measurement sensitivity and accuracy. With integrated linear Dynamic Mechanical Analysis, the HR 30’s two-in-one instrument capabilities empowers users to explore entirely new possibilities for mechanical testing.

Tool specs:
Minimum Torque (nN.m) Oscillation: 0.3
Minimum Torque (nN.m) Steady Shear: 1
Maximum Torque (mN.m): 200
Torque Resolution (nN.m): 0.1
Minimum Frequency (Hz): 1.0E-07
Maximum Frequency (Hz): 100
Minimum Angular Velocity [1] (rad/s): 0
Maximum Angular Velocity (rad/s): 300
Displacement Resolution (nrad): 2
Step Time, Strain (ms): 15
Step Time, Rate (ms): 5
Maximum Normal Force (N): 50
Normal Force Sensitivity (N):0.005
Normal Force Resolution (mN):0.5

Tool specs:
Chuck: 8″
Lever Driven Up/Down
Head Up/Down: 16mm
Probing Z Resolution: 10um
Probe Pin Material: Tungsten Carbide
Probe Pin Spacing: 40mil, 50mil, 62.5mil
Probe Pin Spring: 45grams, 85grams, 180grams
Probe Pin Diameter: 40.6um

Laser cutter (The ometch AF2440-100)
The high-powered CO2 laser cutter offers potent laser beams with heavy duty cutting ability.

Tool specs:
Max. Engraving Speed: 600 mm/s
Max. Cutting Depth: 10 mm
Focus Adjustment: Auto Focus
Laser type: CO2
Laser power: 100W
Processing Area (L×W): 500 mm x 300 mm 
Front/Back Pass-Through Size: 1000 mm x 600 mm 

AutoMet 250 is an advanced grinder-polisher with more power to accommodate a greater capacity for high-volume environments. The straightforward controls remove complexity from the grinding and polishing process.
Save time during preparation and cleaning
Choose the best format for your lab’s needs

Tool specs
Platen Diameter: 8in [203mm], 10in [254mm]
Platen Wheel Speed: 10-500rpm in 10rpm increments
Wheel Direction: Clockwise or Counter-Clockwise
Water Supply Hose: 0.25in [6mm] OD tube
Water Supply Pressure: 40-100psi [25-60bar]
Central Specimen Force: 5-60 lbs [20-260N]
Single Specimen Force: 1-10 lbs [5-45N]

Tool specs:
Layer resolution: 0.25 mm nozzle: 150 – 60 micron, 0.4 mm nozzle: 200 – 20 micron
0.6 mm nozzle: 300 – 20 micron, 0.8 mm nozzle: 600 – 20 micron
XYZ resolution: 6.9, 6.9, 2.5 micron
Nozzle temperature: 180 – 280 °C
Nozzle heat-up time: < 2 minutes Build plate leveling: Advanced active leveling with more accurate inductive sensors Build plate: PEI-coated flexible steel build plate Build plate heat-up time: < 5 minutes (from 20 to 60 °C) Operating ambient temperature: 15 - 32 °C (59 - 90 °F) Print head: Dual extrusion print head with an auto-nozzle lifting system, swappable print cores, and flood detection

High Power Plasma Cleaner is a versatile instrument suitable for etching organic thin films (10-100 nm) as well as surface cleaning and modification.

Tool specs:
Adjustable RF power settings (Low, Medium, High).
Maximum RF power of 45W.

The Oxford PlasmaPro 100 Cobra 300 is plasma-based system for etching and deposition. This tool utilizes a high-density inductively coupled plasma to achieve high-rate dry etching of silicon-based substrates. Its ICPCVD process module is designed to produce high quality films at low growth temperatures, and typical materials deposited include SiO2, Si3N4 and SiON, Si and SiC at substrate temperatures as low as 5 ºC.

Tool specs:
Compatible with all wafer sizes up to 200mm
ICP Power (max): 3000 W
RF Power (max): 600 W
Pieces must be >7mm from edge of carrier to avoid wafer-clamping mechanism
Standard masking materials include: SiO2, Si3N4, photoresist